Designed to scale

Detachable
Fibre-to-chip
Interconnects

Detachable
Fibre-to-chip
Interconnects

For CPO hardware engineering teams.
Standard fibre. Standard processing. Scaleable solution.

For CPO hardware engineering teams.
Standard fibre. Standard processing. Scaleable solution.

The case for less

No micro-optics.

No bump-on-carrier. 

No active alignment. 

No glue.

Everyone else is adding complexity.
We're removing it.

Engineered to perform

Where we are.
Where we’re going.

Company Mission

Deliver 10 mdB loss‡ per connection, reliably across 100 million units.

Demonstrated

Repeatable, detachable connections with <800 mdB loss and <3s passive alignment time. No micro-optics, no BOCs, no active alignment, & no epoxy.†.

Targeted Product

A detachable connection delivering <400 mdB loss‡ per connection with a clear route to 10 million units.

† Further details available under NDA. 
‡ “loss” here means the fibre to integrated waveguide loss.

Backed by proof

Why believe us.

Our team leverages world-class integrated quantum photonics expertise where performance, stability, and repeatability are non-negotiable.

Record-setting performance

Pioneered ultra-low-loss fibre-to-chip connections, enabling record-setting performance for silicon photonic quantum computing, validated in a peer-reviewed publication.

Industry engagement

Working with world leaders in quantum computing and AI hardware, providing solutions trusted by customers, collaborators and partners.

Expert advisors

Supported by key advisors, including Anthony Yu, former VP of GlobalFoundries.

Investor backing

Backed by world-leading AI & quantum investors